Journal and Magazine Papers

Conference Papers

  • N. Rios, R. O. Spínola, M. Mendonça, and C. Seaman. 2018. The Most Common Causes and Effects of Technical Debt: First Results from a Global Family of Industrial Surveys. To appear in Proceedings of ACM/IEEE 12th International Symposium on Empirical Software Engineering and Measurement (ESEM’18).